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GTS100BH-PA平面式高速固晶机

GTS100BH-PA平面式高速固晶机
产品详情


GTS100BH-PA
(平面式高速固晶机)

(周期:50ms)

适用于SMD020,1010,2121,2835,灯丝,COB等


一、机型特性

1.采用国际领先的双固晶,双点胶,双晶片搜寻系统;

2.采用直驱电机驱动邦头;

3.采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C);

4.晶框采用自动角度修正系统;

5.采用可程式恒温点胶系统;

6.采用真空漏晶检测;

7.采用自动式上下料系统,减少换料时间;

8.采用自动装卸晶环系统,有效提高了生产效率;

9.工控机控制设备运行,简化了自动化设备的操作;

10.精准的自动化设备为午影夜院忘忧草 提高生产效率,降低成本提供了有效保障,从而切实有效地提高了午影夜院忘忧草 竞争力;

11. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障。


GTS100BH-PA

Plane-type High-speed Die Bonder

Cycle: 50ms

It is compatible with SMD020, 1010, 2121, 2835, lamp filament, and COB etc.


Product Features

1.      International leading double die bond, double adhesive dispense and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Crystal frame automatic correction chip structure is also applied;

5.      Programmed control constant-temperature adhesive dispensing system is also applied;

6.      Vacuum die missing testing technology is adopted;

7.      Automatic loading and unloading system is applied to saving the time of reloading;

8.      Automatic installing & uninstalling crystal rings is applied to improve the production efficiency largely;

9.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

10.   Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

11.   Precise die bond location and excellent compatibility will guarantee the back-end processing.


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