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GT836M平面式高速固晶机

GT836M平面式高速固晶机
产品详情


GT836M
平面式高速固晶机)

周期:180ms

适用于数码、点阵、大功率、COBSMD

一、机型特性


1.平面式LED灯全自动固晶的最佳选择;

2.高速固晶(180ms/颗,每小时产量为20K)、精准的自动化设备为午影夜院忘忧草 提高生产效率、降低成本提供了有效保障,从而切实有效地提高了午影夜院忘忧草 竞争力;

3. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障;

4.采用直驱电机驱动邦头;

5.采用全新接触式探测系统控制摆臂,有效解决了PCB板或支架高度不一致而导致的固晶问题;

6.采用线性电机驱动晶片搜寻平台(X/Y)与固晶平台(B/C

7.采用可程式恒温点胶系统;

8.采用真空漏晶检测;

9. 工控机控制设备运行,简化了自动化设备的操作;


GT836M

Plane-type High-speed Die Bonder

Cycle: 180ms

It is compatible with digital products, dot matrix, high power, COB, and SMD etc.


Product Features

1.        It is the best choice for full-automation die bond of planar LED lights;

2.        High-speed die bond(180ms/piece, 20K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.        Precise die bond location and excellent compatibility will guarantee the back-end processing;

4.        Linear motor is applied to drive bond head;

5.        New touch-type deep detection system is applied to control the swing arm, solving the bonding issues caused by the non-uniform height of PCB or holder effectively;

6.        Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

7.        Programmed control constant-temperature adhesive dispensing system is also applied;

8.        Vacuum die missing testing technology is adopted;

9.        IPC will control the operation of equipment, simplifying the operation of automation equipment.



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